Product Overview

The CGMS capacitive gap measurement system is a non-contact gap measurement device developed by Feimi based on high-precision capacitive sensing technology. It can sensitively capture distance changes on the surface of the metal workpiece and collect and output multi-point gap measurement data in real time. The system features high measurement precision, wide range, fast response, and stable and reliable operation. It supports multi-point synchronized acquisition to accurately quantify parallelism deviation. For semiconductor thin-film deposition, sputtering, etching, and other process scenarios, it can efficiently complete cavity gap mapping and equipment parallelism adjustment, optimizing process uniformity and effectively improving product yield, machine utilization, and process repeatability.

With wide applications, beyond the semiconductor processing industry, it also covers high-end manufacturing scenarios such as industrial automation production lines, automotive precision parts manufacturing, and new display equipment production. It provides accurate and reliable quantitative data support for equipment installation and commissioning, performance calibration, and online production line monitoring, making it an important measurement solution for gap detection and process optimization in the precision manufacturing field.

CGMS Gap Measurement System

Product Parameters

Parameter Category Specification Remarks
Performance Indicators Dimensions Diameter: 200mm, Plate Thickness: 8mm / Diameter: 300mm, Plate Thickness: 8mm
Weight 305g / 455g
Accuracy ±0.020mm@15mm, 4 hours
Resolution 0.008mm
Temperature Range 0 - 70°C
Measurement Distance 9mm ~ 21mm
Operating Pressure 10⁻⁶ ~ 0.1MPa
Battery Duration >8 hours
Communication BlueTooth, 2.4GHz
Product Components Calibration device, power adapter, USB charging cable, connection module and application system, user manual

Product Advantages

01
Non-contact

Using capacitive sensing technology, no direct contact with the measured object is required, avoiding wear, damage, or contamination caused by contact.

02
High Precision

CGMS achieves a measurement precision of ±0.020mm; it provides highly repeatable measurement results, ensuring consistency in each measurement.

03
High Reliability

The housing is made of anodized aluminum, sturdy and durable with good stability, suitable for various environments. A single charge supports continuous temperature measurement for over 8 hours.

04
Fast Response

Quickly completes gap measurement and parallelism detection with fast measurement speed, suitable for dynamic measurement.

05
Easy Operation

Supports automatic processing, accelerates equipment setup maintenance and troubleshooting, saving time and labor; the host computer displays numerical and graphical data in real time, making it easy to quickly identify whether it is within the target range.

Application Scenarios

The CGMS capacitive gap measurement system is widely used in mechanical manufacturing, semiconductor processing, automotive manufacturing, display manufacturing, and other fields, providing reliable solutions for precision measurement in various industries.

Mechanical Manufacturing

Mechanical Manufacturing

Online inspection of precision rotary parts, brake discs, and transmission components, measuring end face parallelism, axial clearance, and runout to ensure assembly precision and reduce equipment wear.

Semiconductor Processing

Semiconductor Processing

Wafer platform gap and carrier parallelism calibration, enabling precise gap monitoring at wafer processing, bonding, and lithography stations. Non-contact, no wafer contamination, stabilizing semiconductor process yield.

Automotive Manufacturing

Automotive Manufacturing

Quality inspection of brake discs, new energy motors, and automotive body parts on automated production lines, with online gap and flatness detection to strictly control parts processing and assembly quality.

Display Manufacturing

Display Manufacturing

Gap and parallelism detection in display substrate and optical glass lamination processes, preventing substrate scratches, improving panel lamination quality, and reducing lamination defects.